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Thread Status: Active Total posts in this thread: 19
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KLiK
Master Cruncher Croatia Joined: Nov 13, 2006 Post Count: 3108 Status: Offline Project Badges:
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@vlado101
----------------------------------------yes, now you got it! More time towards the badges is nice, but I want to contribute as much as my system allows. Therefore I don't mind more heat, I just want to make sure that heat doesn't destroy my machine too early. that's what TThrottle is doing...'cause how much "down time" is good for a WCG crunching?! so just set the 80-85% of Tjunc & crunch happily! no crashes, no hick-ups...time is going, 'cause BOINC is on 100% of CPU time...& everybody's happy! ![]() ---------------------------------------- [Edit 1 times, last edit by KLiK at Nov 18, 2015 2:24:01 PM] |
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noderaser
Senior Cruncher United States Joined: Jun 6, 2006 Post Count: 297 Status: Offline Project Badges:
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Sounds good, thanks for explaining that. So I see that max temp of the processor is 100 then set it to 80c and just let it run? That's a good point to start at; you can adjust it up or down if you're feeling adventurous or want to control the fan noise more. |
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vlado101
Senior Cruncher Joined: Jul 23, 2013 Post Count: 226 Status: Offline Project Badges:
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So far so good. I do have another question, and maybe it's kinda dumb, but what about laptops that have ssd and no fan outlet? I have seen this on some of the smaller laptops where they do not have a fan in the and are very thin.
----------------------------------------Does the fact that they do not have moving parts means that they have much less heat? How would they work when using WCG or BOINC. I think even some of the newer Mac books had this where its very thin and do not have a CD/DVD drive. Please let me know if anyone has such a device or if I am understanding it wrong. ![]() |
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noderaser
Senior Cruncher United States Joined: Jun 6, 2006 Post Count: 297 Status: Offline Project Badges:
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The small form-factor systems aren't fanless because of the drive, but because they utilize low-power chips with low "Thermal Design Power". Some of the latest Broadwell ultra-mobile chips use 15 W, or even as little as 3.5-6 W for some of the really low-power Core M and Atom chips. More common "standard" power and desktop chips are usually 30-40 W or even as high as 95 W for some server and workstation grade chips.
----------------------------------------Higher TDP means more heat, so systems that use low TDP chips may be able to get away without using fans to dissipate heat away from the CPU. They still generate some heat and if you're using one of those you may notice the system throttling itself to prevent damage to the CPU. However, the CPU throttling doesn't take into account the ability of adjacent components to handle the heat, which can be troublesome in tablets, especially when the battery is close enough to get some CPU heat. I gave my Atom-powered Windows tablet (Asus Transformer Book T100) to a family member, but I was using it with BOINC and didn't notice many heat-related issues, the problem with it was the USB charging interface. It was barely able to supply enough power to run BOINC and charge the battery. Even without BOINC, it would often be draining the battery if the tablet was in use while plugged in--so if you drained the battery and still wanted to use it you had to let it charge a bit first. On Android devices, there have been some issues with degraded battery performance from the heat load--which is why BOINC for Android has a built-in temperature setting that stops computation when the battery reaches a specified temperature and charge level. I haven't looked at any of the new MacBook offerings, but most of the older ones had the fan vents hidden in the hinge area and weren't readily visible. I see the new "Retina display" MacBooks have ultra-low power Core M (3.5-6 W) processors, so they probably don't have fans--but the MacBook Pros will still have the hidden vents for their i5 and i7 chips. |
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KLiK
Master Cruncher Croatia Joined: Nov 13, 2006 Post Count: 3108 Status: Offline Project Badges:
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exactly what noderaser wrote +:
----------------------------------------some laptops use thermal-conductive pads...which use power to lower temperature on one side of the pad, while heating the other side...SONY VAIO used something similar in older models (don't know about new ones)... also, some laptops dissipate heat across a whole surface of aluminum, which is btw thermo-conducting unlike plastic! So far so good. I do have another question, and maybe it's kinda dumb, but what about laptops that have ssd and no fan outlet? I have seen this on some of the smaller laptops where they do not have a fan in the and are very thin. Does the fact that they do not have moving parts means that they have much less heat? How would they work when using WCG or BOINC. I think even some of the newer Mac books had this where its very thin and do not have a CD/DVD drive. Please let me know if anyone has such a device or if I am understanding it wrong. you also are messing up temperature & heat...a CPU has a TDP, a max heat that it dissipates... it also has a Tjunc, which is a top temperature on which it operates! program are written to regulate according to temperature of CPU... there's not heat sensor on CPU (yet, that I know of)... ![]() |
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noderaser
Senior Cruncher United States Joined: Jun 6, 2006 Post Count: 297 Status: Offline Project Badges:
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some laptops use thermal-conductive pads...which use power to lower temperature on one side of the pad, while heating the other side...SONY VAIO used something similar in older models (don't know about new ones)... Are you referring to a Peltier junction? I wasn't aware that there were any consumer-level products that used those for cooling... Most use "heat pipes" that use a liquid inside a copper tube that turns into a vapor and carries heat energy away from its source. |
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KLiK
Master Cruncher Croatia Joined: Nov 13, 2006 Post Count: 3108 Status: Offline Project Badges:
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some laptops use thermal-conductive pads...which use power to lower temperature on one side of the pad, while heating the other side...SONY VAIO used something similar in older models (don't know about new ones)... Are you referring to a Peltier junction? I wasn't aware that there were any consumer-level products that used those for cooling... Most use "heat pipes" that use a liquid inside a copper tube that turns into a vapor and carries heat energy away from its source. yes, TEC...that's what I've heard & saw...but only some fancy VAIO laptops came with it! but, do you know which vapor is inside those cooper tubes?! ![]() |
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noderaser
Senior Cruncher United States Joined: Jun 6, 2006 Post Count: 297 Status: Offline Project Badges:
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some laptops use thermal-conductive pads...which use power to lower temperature on one side of the pad, while heating the other side...SONY VAIO used something similar in older models (don't know about new ones)... Are you referring to a Peltier junction? I wasn't aware that there were any consumer-level products that used those for cooling... Most use "heat pipes" that use a liquid inside a copper tube that turns into a vapor and carries heat energy away from its source. yes, TEC...that's what I've heard & saw...but only some fancy VAIO laptops came with it! but, do you know which vapor is inside those cooper tubes?! ![]() Many of them use a water-based solution, it depends on the application... https://en.wikipedia.org/wiki/Heat_pipe |
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Kasey Domer
Cruncher United States Joined: Jul 24, 2013 Post Count: 44 Status: Offline Project Badges:
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Hey, folks,
----------------------------------------I'm a little late to the game here, but I figured I'd comment on the Retina Macbook 2015, as I know someone who uses it under load. It is fanless, and even though it's initially using a 4.5W Intel Core M5-5Y31 at 900MHz, Apple decided to configure it to the 6W, 1.1GHz option Intel allows. However, due to the extremely thin, unibody aluminum, fanless design, it WILL throttle after a few minutes under load and will refuse to turbo boost due to CPU temps nearing 100*C. Honestly, the RMB 2015 is a beautiful device, but it's all show and no go. I definitely wouldn't recommend it for crunching. As for the MBP, I know that the dual-core (13") versions will crunch fine without heat issues on the current (Broadwell) and previous (Haswell) CPUs. However, I'm not sure that the 15" quad-core models are the same way. My guess is that there may be some throttling there, since the quad-core models haven't been upgraded to Skylake yet, and Haswell chips generate quite a bit of heat. Hopefully the Skylake refresh (whenever Apple decides to get around to it) will fix that. ![]() Crunchers: 1: Xeon E5-2695 v3 @ 2.5GHz turbo (14C/28T) 2: Xeon E5-2658 v3 @ 2.3GHz turbo (12C/24T) 3: Ryzen 7 1700 @ 3.675GHz OC (8C/16T) 4: Core i7-4700MQ @ 3.2GHz cTDP up (4C/8T) [Edit 1 times, last edit by Kasey Domer at Feb 25, 2016 6:54:00 AM] |
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